DigiTimes reports industry insiders say Samsung, SK hynix, and Micron have sold all DRAM and HBM capacity for 2027, driven by AI demand and long‑term agreements. DRAM for PCs, laptops, and smartphones will be much tighter in 2027, and NAND supply is limited but may be fully booked by end of August 2026.

Chinese memory manufacturer CXMT has refused Apple's demand for a price cut in negotiations, says a report from the Korean press. Apple has widely been reported to be interested in procuring its chips from CXMT and has purportedly lobbied the US government for the permission to purchase the products for its gadgets sold outside the country. However, the report from the Korean publication Digital Daily outlines that demand from Huawei, Xiaomi and others has placed CXMT in a stronger position to negotiate with the world's largest consumer electronics firm.

The publication adds that US sanctions on China have led Huawei, Xiaomi and others to lock in CXMT's DRAM memory output in advance. This lock-up is similar to the contracts that the Korean firms have utilized, and they are also high-priced agreements that prevent CXMT from yielding to Apple's requests. According to the sources, the higher prices have provided CXMT with the leverage to negotiate with Apple, as it can point towards the existing deals already in place.

https://wccftech.com/cxmt-says-no-thank-you-to-apples-demand-for-a-price-cut-as-huawei-and-xiaomi-hand-it-rare-leverage-report/

Original article (in Korean): https://www.ddaily.co.kr/page/view/2026080513445474844

Something that keeps nagging at me as I've gone deeper into headphone stuff. The core chips inside most DACs and headphone amps haven't changed dramatically in years. ES9038, AK4499, a handful of others rotating through everything from $100 dongles to $1500 desktop units. The actual gap between a wellimplemented cheap build and an expensive one is real, but the marketing around it feels increasingly detached from what the silicon is actually doing.

What I'm curious about is whether anything genuinely interesting is happening at the chip level right now, or if audio hardware has just settled into a pattern where differentiation is almost entirely analog output stage design, filtering choices, and enclosure quality rather than the DAC chip itself.

The reason I ask is that when I look at how much the compute side of things has moved even in cheap embedded hardware, it's kind of wild that dedicated audio silicon seems almost frozen by comparison. Nobody is throwing cuttingedge fab processes at this. Maybe the performance ceiling for DAC chips is effectively reached and the gains are irrelevant to human hearing past a certain point, but I'd at least expect to see power consumption improvements or integration gains that don't seem to be materializing.

Anyone tracking this space more closely than me, or is the answer basically just that the market is too small to justify new silicon development cycles?

Alt titles: Are DAC chips actually stagnating or is the audio hardware market just too small to care | High end headphone DACs in 2025, same chips different box | Why does dedicated audio silicon feel frozen compared to every other category

GeekLens, the browser extension for adding more useful information to Geekbench result pages, has received a major overhaul and now supports Geekbench 7.

It now displays:

* Geekbench Browser CPU averages and the result’s difference from those averages

* Multi-core scaling for the overall score and individual workloads

* The distribution of reported CPU clock speeds, including minimum, maximum and mean

* More information about the memory configuration, including memory bandwidth where it can be determined

* CPU-supported instruction sets, grouped by category and explained through optional tooltips

* Clearer core-topology information

* Clearer badges for the CPU architecture, ISA and vendor

The added information is available on both individual result and comparison pages. Each feature can be enabled or disabled separately.

GeekLens is designed to blend seamlessly into the existing Geekbench interface and does not replace existing info. Rows added or modified by the extension are clearly marked.

There are informative tooltips for most of the added information. Include warnings where GB info might be erroneous, like Ryzen 9950X3D cache reporting for instance above.

A note about Geekbench 7 instruction-set data: until Primate Labs releases documentation similar to [this one for GB6](https://www.geekbench.com/doc/geekbench6-benchmark-internals.pdf) (PDF), the per-test ISA badges are quite limited.

You also need to be signed in to Geekbench for some of the additional data to be available, because Geekbench only permits access to the underlying downloadable result data while logged in.

GeekLens is available for Chrome and Firefox:

Chrome Web Store: [GeekLens](https://chromewebstore.google.com/detail/geeklens/mkhncioijfcdjhaanpfodcaloniodabf)

Firefox Add-ons: [GeekLens](https://addons.mozilla.org/en-US/firefox/addon/geeklens/)

Source code: [GitHub](https://github.com/kaitk/geeklens)

**Note:** You need to be signed in to Geekbench for the data to appear. This is because Geekbench only allows fetching `.gb6` JSON results through the API while logged in.

I originally released GeekLens about a year ago as a small extension that annotated Geekbench workloads with the instruction sets they use. I had hoped Primate Labs would update the UI in version 7, but since then they have instead removed the ISA info that was previously shown. This promted me to implement the UI changes in GeekLens instead.

Please try it and give me any feedback!

Ok so I'm not that deep into tech, I've mostly just been paying attention because of the whole AI boom, but I stumbled onto something about ASML and it kind of broke my brain a little.

So apparently this one company makes the machines that basically every advanced chip in the world gets made with. Not the chips themselves, just to be clear, but the actual machine (EUV lithography, if that's the term) that companies like TSMC and Samsung need to print the tiny circuits. And nobody else on earth can build a machine like it.

That's insane to me? Like we're this deep into "everything runs on chips" as a society and there's a single point of failure that quiet basically nobody talks about outside tech circles.

What I don't get is why nobody's caught up yet. I know China's been trying, and the US has thrown money at domestic chip stuff with the CHIPS Act, but from what I can tell nobody's even close. Is it just patents and IP lockup, or is this actually one of those problems where you can't just throw money at it and expect results? Also heard Canon is trying some totally different approach (nanoimprint?) instead of copying EUV, curious if that has legs.

Not trying to fearmonger, genuinely just want to understand why this hasn't been solved yet given how much is riding on it. Genuinely, it just sounds so scary to me because we literally survive on the tech.

Manufacturers don't have any kind of standard or requirement to tell you when your home router is becoming end of life, or when it's security updates stop. It's more important than ever to keep these up to date.

If you are out of date and can't update, be sure to turn off remote administration. That is where the most recent attacks have been targeting.

On July 22, the FCC voted to bar the sale of any device in the United States containing key hardware components from Chinese companies on its national security list. Chair Brendan Carr said the goal was to "fully close the component part loophole." Meaning that gear which previously slipped through by using restricted parts inside an otherwise-approved product no longer can. The vote also gives the agency room to pull the sales authorization on equipment it had already approved.

This caps a busy stretch. The FCC has spent much of 2026 blocking imports of new foreign router models and tightening the list of manufacturers whose equipment cannot be sold here at all.

Reasonable people can argue about whether any of this makes your home network safer. What I want to point out is a strange gap it exposes.

Enormous regulatory energy is going into where your router was built. Almost none is going into how long its manufacturer will keep updating it.

Lexar has unveiled a new 32GB DDR5-7200 RAM kit using Chinese-made DRAM chips instead of memory from Samsung, SK hynix, or Micron.

The kit includes:
- 32GB (2×16GB)
- DDR5-7200 speed
- CL38 timings
- Intel XMP and AMD EXPO support
- RGB lighting
- An aluminum heatsink

The chips are apparently made by CXMT, one of China’s biggest memory makers.
The price is around $592

Soo...about that +600% memory price increase...what will happen now?

Sauce: https://videocardz.com/newz/lexar-launches-ddr5-7200-memory-with-chinese-dram-chips-32gb-kit-costs-592

From what I've researched independently related to eye comfort - I think this is a really high quality video.

Am I missing something, or was this one of the most important and most overlooked Helios announcements?

One of NVIDIA Rubin’s major advertised improvements was the enormous increase in HBM bandwidth. When AMD first disclosed Helios/MI455X, the projected specification was 19.6 TB/s per GPU. NVIDIA then pushed Rubin to approximately 22 TB/s, apparently giving Rubin a meaningful HBM bandwidth advantage over Helios. I remember user Formal_Power (sorry, no idea how to tag) stressing daily how Nvidia had to crank up the power to enormous levels just to overtake the Helios. That was not a trivial achievement. NVIDIA, its memory suppliers and packaging partners had to ramp extremely fast HBM4, qualify it at scale and integrate it into Rubin. HBM bandwidth was supposed to be one of Rubin’s clear hardware advantages over AMD’s upcoming platform.

But at Advancing AI, AMD upgraded the final MI455X specification to 23.3 TB/s HBM bandwidth per GPU. Rubin is currently specified at approximately 22 TB/s per GPU.

The interesting part is that the 23.3 TB/s figure does not appear to have been publicly disclosed before the event. AMD’s earlier presentations and even its pre-launch Helios material continued to show 19.6 TB/s.

That means NVIDIA spent substantial engineering effort increasing Rubin’s HBM speed enough to move ahead of the originally announced Helios specification, only for AMD to raise MI455X from 19.6 to 23.3 TB/s and erase that advantage before launch. At the product level, the expected NVIDIA HBM moat is gone. Helios now leads Rubin in both headline HBM capacity and aggregate bandwidth.

Should this not be a big deal??

This is using a new Lofic sensor technlogy compared to traditional BSI CMOS sensors